• ZJ-EPDAS01
    Conductive solid crystal adhesive

    ZJ-EPDAS01 is a single component conductive silver adhesive based on epoxy resin, suitable for bonding small-sized IC chips, LED chips, and metal lead frames/substrates

    Product features

    No solvent

    High bonding strength

    Good conductivity

    High speed dispensing

    Good rheological performance, no trailing wire drawing

    Low impurity ion content

    Product parameters
    Main parameters of ZJ-EPDAS01
    Classification

    Properties

    Unit

    Index

    Test Method

    Properties before curing

    Appearance

    ---

    Silvery

    Visual

    Viscosity)5rpm@25℃

    Pa?S

    8.0±0.5

    Brookfield Viscometer
    CP-51

    Thixotropic Index
    0.5rpm/5rpm @25℃

    n/a

    5.8±0.2

    Non-volatile Content

    wt%

    >99.5

    JIS-C-2103(105℃×2h)

     Work life@25oC
     

    hour

    48

    Q/HZQB-002-2020

    Storage life @-40oC

    Month

    12

    Q/HZQB-002-2020

    Curing process

    Cure Condition

    1.5h@175

    Weight Loss on cure@300o

    <1%

    Properties after curing

    Chip Die Shear Strength

    25

    KgF

    >4.0

    chip size:
    1mm×1mm.

    >14.0

    chip size:
    2mm×2mm.

    160

    >1.0

    chip size:
    1mm×1mm.

    >2.0

    chip size:
    2mm×2mm.

    220

    >1.5

    chip size:
    2mm×2mm.

    260

    >1.5

    chip size:
    2mm×2mm.

    Impurity Ionic content

    Cl-

    ppm

    <10

    Ion Chromatography

    Na+

    ppm

    <10

    K+

    ppm

    <20

    Volume Resistivity

    Ω.cm

    <1.2×10-4

    175℃ × 1.5h curing

    Glass  Transition Temperature

    105±2

    Dynamic Mechanical Analysis

    Modulus@25℃

    GPa

    >5

    Thermal Conductivity)@ 121oC

    W/m·K

    >3.5

    Laser Flash method)

    Coefficient of thermal expansion

    Alpha 1

    ppm/

    65±15

    Thermal Mechanical Analysis

    Alpha 2

    ppm/

    160±20

    The data in the table is for reference only, please refer to the measured data
    Operation and Safety
    • Before use, it needs to be thawed at room temperature for 30-60 minutes.
    • Please keep the syringe upright throughout the entire process of removing and thawing it from the freezer.
    • Do not open the syringe until thawing is complete to prevent moisture from entering.
    • After thawing, promptly remove the condensed water on the surface of the syringe.
    • After thawing, it should be used as soon as possible.
    • The thawed glue cannot be frozen before thawing for use
    Color and packaging

    According to specific requirements, 5cc/10cc needle tube packaging or 200g, 500g can packaging can be provided

    Storage and expiration date

    -It can be stored for 1 year at 40 ℃. Excessive storage temperature can shorten storage life and affect product performance.

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